Vertically integrated fabrication across California and Arizona — from raw lithium niobate wafers through finished space-qualified OCT terminals, with a 100% domestic supply chain.
Vertically integrated fabrication across California and Arizona — from TFLN wafer growth and chip fabrication to OCT assembly and qualification testing. Domestic supply chain eliminates foreign dependency and enables 5× cost reduction through in-house manufacturing.
Complete chain from raw lithium niobate wafers through finished space-qualified OCT terminals. Every step — sputtering, lithography, ion slicing, bonding, assembly, environmental testing, and final integration — happens within NantNova’s own facilities or trusted US partners.
NantNova’s California fabrication facilities house the complete manufacturing pipeline — from TFLN and ETFLN wafer growth through chip processing, optical assembly, and system integration. ISO Class 7 cleanroom environments support precision optical alignment, bonding, and qualification testing.
The ETFLN line uses ion slicing with He+ implantation to produce ultra-thin LN films with no lattice damage, enabling modulator bandwidths up to 110 GHz with superior uniformity versus bulk LN.
NantNova’s headquarters and system-level integration center. Home to final test, program management, and engineering design teams. Rooted in Optilab, founded in 2003, with 20+ years of continuous operation in photonic and optoelectronic solutions for defense, aerospace, and research markets.
NantNova’s R&D center drives next-generation photonic and optoelectronic development. Engineering teams design, prototype, and validate new subsystems — from advanced modulator architectures to novel optical front-end configurations — before transitioning to the California production line.
NantNova's engineers and technicians at work in our cleanroom and lab facilities.
| Parameter | Specification |
|---|---|
| TFLN Wafer Size | Up to 4-inch diameter |
| LN Film Thickness | ~8 µm (ion-sliced) |
| Modulator Bandwidth | Up to 110 GHz |
| Clean Room | ISO Class 7 (10,000) |
| Thermal Test | -55°C to +125°C chambers |
| Vibration Test | 14.1 Grms random vibe shaker |
| OCT Variants | 2.5G, 10G, 25G, 100G, 200G |
| Housing | Aluminum (prototype), Titanium (flight) |
| Supply Chain | 100% domestic US |
| Cost Advantage | 5× lower than incumbent solutions |
From TFLN wafer fabrication to space-qualified OCT assembly — discover NantNova’s vertically integrated, 100% US manufacturing capability.