Extends NantNova's processing architecture to 200 Gbps+ and beyond, leveraging COTS chipsets for dense constellation deployments requiring 10G, 25G, 100G, and 200G data rates.
Next-generation constellations need bandwidth that today's space electronics can't deliver—or can't deliver affordably. Traditional rad-hard ASICs run $2M+ per design spin and top out at 10G. The DPU-X solves this by integrating proprietary silicon into space-qualified packaging, hitting 200 Gbps+ per link at 5× lower cost than incumbents.
The result: telecom-grade throughput in a space-grade form factor. Whether you're building a 100-satellite mesh or a high-capacity trunk link to ground, the DPU-X scales from 10G to 200G per channel with 335 Gbps aggregate—all on a single board that speaks SDA, ORAN, and 5G NR natively.
The DPU-X runs simultaneous channels at 10G, 25G, 100G, and 200G—dynamically allocating bandwidth across crosslinks and downlinks based on mission demand. Proprietary chipsets handle the heavy lifting while NantNova's space-qualified packaging ensures survival through launch, radiation, and thermal extremes.
Native support for 3GPP 5G NR fronthaul and ORAN means the DPU-X bridges the gap between space and terrestrial networks, enabling seamless handoff from satellite backbone to ground infrastructure.
DPU-X — Front Panel with TX/RX Connectors and SFP+ Ports
DPU-X — 3/4 View
Scale your constellation links to 200 Gbps+ and beyond with NantNova's COTS-based high-speed link system.