NantNova delivers space-qualified photonic and electronic subsystems for optical communication, navigation, and directed-energy applications. With a 100% US supply chain and vertically integrated fabrication, we achieve 5× lower cost than incumbents while meeting the most demanding space and defense qualification standards.
NantNova Group Overview
NantNova Solutions Overview
Why NantNova Is Different
Our OCT components and photonic subsystems are deployed across defense, civil space, and commercial programs—from LEO constellations to national laboratories. Our JAXA-deployed LEO-to-GEO optical link has operated continuously for 3+ years on orbit.
NantNova products are qualified for space, datacenter, and airborne environments. Our photonics radiation qualification program and electronics radiation hardening ensure reliable operation across LEO, MEO, and GEO orbits with extended mission lifetimes.
Photonics and electronics radiation qualification for LEO–GEO orbits. TID and SEE testing per MIL-STD-883.
Qualified for −40°C to +85°C operational range. OCT baseplates tied to radial heat pipes for passive thermal management.
Launch-load qualified random vibration and shock profiles. Titanium housing options for maximum structural integrity.
Materials screened per ASTM E595 for low outgassing. Full vacuum operation validated for on-orbit deployment.
Electromagnetic compatibility tested per MIL-STD-461. Clean spectral emissions for multi-payload missions.
3+ years continuous operation on JAXA LEO-to-GEO optical link. 1540/1580 nm, beacon-less acquisition in <60 seconds.
A growing portfolio of 8 granted patents, 2 published applications, and 6 pending filings covering TFLN fabrication, optical communication terminals, LiDAR, sensors, and photonic integrated circuits.
Vertically integrated fabrication across multiple US sites—from TFLN wafer growth and chip fabrication to OCT assembly and qualification testing. Our domestic supply chain eliminates foreign dependency and enables 5× cost reduction through in-house manufacturing.
Primary US fabrication site for thin-film lithium niobate wafers and photonic chips. Houses the complete TFLN process chain from ion slicing and wafer bonding through e-beam lithography, ICP-RIE etching, and die-level packaging.
Dedicated enhanced thin-film lithium niobate line using our proprietary ion-slicing process. Produces ~8 μm LN films with zero lattice damage—achieving 110 GHz bandwidth while maintaining crystal integrity that bulk grinding and CMP cannot match.
Clean room facilities for SatLight™ OCT assembly, PAT integration, and qualification testing. Prototype through pilot production capacity supporting 2.5G, 10G, and 100G terminal variants with titanium housing options for flight units.
Complete domestic fabrication from raw lithium niobate wafers through finished space-qualified OCT terminals. Vertical integration across wafer fab, chip fab, photonic assembly, and system integration delivers 5× lower cost than competitors while eliminating foreign supply chain risk.
NantNova is building the photonic backbone of space communications. We need engineers, scientists, and builders who want to do the most meaningful work of their careers—designing and fabricating the systems that connect satellites, defend allies, and extend humanity’s reach beyond Low Earth Orbit.
TFLN chip design, optical assembly, and process engineering for space-qualified photonic subsystems.
RF/mixed-signal, FPGA, and PCB design for high-speed data processing and control systems.
OCT architecture, integration & test, thermal/structural analysis for flight-qualified terminals.
Cleanroom fabrication, quality assurance, and supply chain management across our US facilities.
From DARPA Space-BACN to commercial LEO constellations, NantNova delivers the photonic subsystems your mission demands. Let’s discuss how our vertically integrated US supply chain can accelerate your program.